### Original citation matrix

Review electrostatic discharge (ESD) protection across unpacking, temporary storage, process transfer and repacking. This original editorial synthesis by Huitai PCB, version 1.0, helps manufacturing handoff personnel identify what information each recipient needs. Every proposed action and responsibility below is an engineering recommendation for project assessment. The matrix establishes neither packaging qualification nor production approval.

The supplier guidance concerns semiconductor components, sensitive devices and subassemblies within the scopes stated below. For an unpackaged assembled board, request an assessment of its installed devices and actual exposure environment before applying component-packaging examples.

| Stable row reference | Review item | Protected item and source basis | Information to request — engineering recommendation | Responsibility interface — engineering recommendation | Assessment question and unresolved inputs |
| --- | --- | --- | --- | --- | --- |
| transition-matrix:unpacking | Before unpacking | Identified sensitive components or an assembled board requiring project assessment. NXP describes protected partial bulk unpacking; Analog Devices advises grounded-workstation opening and minimized handling. See sources N and A. | Identify the items, current handling instructions, intended workstation and receiving person. Record questions where information is missing. | Sender provides item identity and instructions; recipient examines the proposed receiving arrangement. Agree who supplies missing workstation evidence. | Does the information address the actual items and intended workstation? Sensitivity, current documents and actual controls remain project inputs; this row does not qualify the workstation. |
| transition-matrix:temporary-storage | Storage after opening | Opened components or an assessed assembled board. NXP describes original-package storage and repacking temporarily stored components; Analog Devices covers original protective packaging in inventory. ST lists storage areas and containers within its through-hole package guidance. See sources N, A and S. | Describe the proposed packing or carrier, storage location, applicable item instructions and supporting evidence; make these available to the next recipient. | Storage party describes the arrangement and its applicability basis; next recipient examines that information. Agree responsibility for outstanding storage questions. | Is there an item-specific basis for the proposed storage arrangement? Actual conditions and applicable instructions remain inputs. No universal material, duration, humidity, resistance limit or inspection frequency is specified. |
| transition-matrix:repacking | Packaging for the next stage | Components or an assessed assembled board entering another handling environment. NXP addresses temporary-storage repacking; Analog Devices addresses subassembly packaging and qualifies final shipping packaging with “if required.” ST directs readers to product/package information. Texas Instruments describes particular configurations and associated evaluation. See sources N, A, S and T. | Request the complete proposed configuration, current item documents, customer requirements, next environment, applicability basis and available verification evidence. | Packing party supplies configuration information and evidence; receiving party examines their relevance to the next stage. Designated project parties assess gaps. | Does the evidence concern this complete configuration and these items? A material description or packaging availability alone does not establish suitability. No supplier example or historical test result qualifies this arrangement. |
| transition-matrix:process-transfer | Movement between operations | Items moving from a sending area to a receiving area. Analog Devices describes delivery to manufacturing in original protective packaging; ST lists storage/work areas, trolleys, containers, personnel equipment and machine/tool considerations within its through-hole package scope. See sources A and S. | Map the sending area, transport container or carrier, relevant trolley and handling controls, and receiving area. Request evidence appropriate to the actual exposure path. | Agree who provides route and control information and who examines it on receipt. Identify the party responsible for unresolved applicability questions. | Does the information cover the actual route and items? This is a planning method; it neither requires identical equipment for every transfer nor confirms any factory's implementation. |
| transition-matrix:missing-information | Incomplete assessment inputs | Any item whose proposed handling arrangement lacks relevant information. ST directs readers to product and package specifications and its sales department for available packaging information. See source S. | Identify the missing document, condition or evidence, the assessment question it affects and the designated party from whom to request it. | Project parties agree who supplies and assesses the missing information before relying on the proposed arrangement. | Is there enough applicable evidence for the responsible parties to assess the proposal? Responsibility and resolution remain to be agreed. Completing a field does not establish compliant handling or decide release, rework or scrap. |

Source basis and applicable limits:

- Source N — [NXP, AN10365: Surface mount reflow soldering](https://www.nxp.com/docs/en/application-note/AN10365.pdf), Rev. 8, 1 October 2021, page 26, section 6.1.2, Receipt and storage of components. NXP recommends retaining original packing during storage, protected-workstation partial bulk unpacking, and conductive or anti-static packing or carriers for temporarily stored components. These are component-handling statements, not universal assembled-board packaging rules. Page 3 explains that guidance has been incorporated into package-family application notes and this document remains for older references.
- Source A — [Analog Devices, MT-092: Electrostatic Discharge](https://www.analog.com/media/en/training-seminars/tutorials/mt-092.pdf), Rev.0, marked 01/09, copyright 2009, page 5, Figure 6, customer incoming-inspection, inventory and manufacturing entries. Its sensitive-device guidance covers grounded-workstation inspection/opening, minimized handling, original protective packaging for storage and delivery, and static dissipative packaging for subassemblies. The separate final shipping entry says “if required.” This historical tutorial establishes neither identical sensitivity for every assembled board nor sufficient packaging performance for a particular assembly. Port-immunity and device-test sections are outside this matrix.
- Source S — [STMicroelectronics, TN1225: Mounting instructions for THD (through-hole device) packages](https://www.st.com/resource/en/technical_note/tn1225-mounting-instructions-for-thd-through-hole-device-packages-stmicroelectronics.pdf), Rev 3, September 2026, page 13, sections 4.1.1–4.1.3 and 4.2. Here THD means through-hole device; the guidance concerns that package category. Its protection lists provide review dimensions, not evidence of site implementation or mandatory equipment for every assembled board. Section 4.2 directs readers to product/package specifications and the supplier's sales department for packaging availability; availability does not establish qualification for a handling path. No supplier contact or project packaging assessment is represented here.
- Source T — [Texas Instruments, Electrostatic Discharge Protective Semiconductor Packing Materials and Configurations](https://www.ti.com/lit/an/szza027a/szza027a.pdf), SZZA027A, April 2002, pages 6–8, Typical ESD-Protective Packing-Material Configurations; page 9, Static Voltage Test on Loaded Tape-and-Reel Material; page 10, Test Requirements for Material Properties Confirmation; and page 14, Conclusions. This report describes specified configurations, materials, tests and an internal material-verification requirement. Its emphasis on configuration-specific protective effectiveness informs the request for evidence. It establishes neither current supplier practice nor arbitrary packaging suitability; its numerical limits and test results are not adopted as project acceptance criteria.

Method and decision boundary: the original contribution is the connection between a handling node, the evidence a recipient needs, responsibility questions and unresolved inputs. Supplier guidance supplies the bounded handling context; the matrix structure, information requests and responsibility interfaces are editorial recommendations. No supplier table, graphic or document prose has been reproduced as the matrix, and no measurements, factory trials or executed Huitai procedures are claimed.

Before applying the matrix, designated project parties need item identities, current product/package documents, sensitivity and packaging requirements, customer instructions, actual route and receiving conditions, control and verification evidence, relevant abnormal-handling history and agreed responsibilities. These remain assessment prerequisites. The captured documents are not established as the latest applicable instructions for any particular item.

Conductive, dissipative, anti-static and shielding descriptions are not treated as interchangeable evidence. Different supplier materials, methods and historical numerical descriptions are not combined into a common threshold. The matrix sets no mandatory test method, acceptance limit, signing system or record-retention period and asserts no standard clause or standards compliance. Such additions require applicable original normative evidence and project applicability assessment. Common references to standards do not constitute independently verified normative support or separate experiments.

The matrix does not address product-port immunity, certification testing, moisture-sensitive reflow release, baking or exposure-time resets. It supplies no current-batch disposition and makes no claim about Huitai equipment, staff practices, packaging qualification, inspection coverage or completed verification.

Huitai PCB; original article and chart copyright: 深圳市会泰精密科技有限公司.

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