TECHNICAL CAPABILITIES

Every board type.
Built to your spec.

From standard FR4 to Rogers high-frequency, HDI micro-vias, rigid-flex, and aluminum MCPCB — we cover the full spectrum of PCB fabrication technologies.

From 2-layer prototypes to 30-layer production boards.
01
Standard
MULTI-LAYER PCB
CAPABILITY 01

From 2-layer prototypes to 30-layer production boards.

We fabricate PCBs from single-sided to 30 layers using FR4 (TG130/170/180) as standard substrate. Standard 4–6 layer turnaround is 5 business days. Controlled impedance available across all layer counts.

1–30 layers
FR4 TG130 / TG170 / TG180
Min board thickness: 0.4mm
Max board size: 600×500mm
Min hole size: 0.15mm
Impedance control ±10%
Micro vias, blind vias, buried vias for compact designs.
02
Advanced
HDI — HIGH DENSITY INTERCONNECT
CAPABILITY 02

Micro vias, blind vias, buried vias for compact designs.

HDI technology enables smaller boards with higher component density. We support any-layer HDI with laser-drilled micro vias down to 0.1mm, blind and buried vias, and trace widths down to 3mil. Essential for smartphones, wearables, and high-speed digital designs.

Min trace/space: 3mil / 3mil
Laser micro via: 0.1mm
Blind & buried vias
Any-layer HDI available
Sequential lamination
Via-in-pad with fill & cap
RF and microwave boards with controlled dielectric properties.
03
High-Frequency
HIGH-FREQUENCY — ROGERS / PTFE
CAPABILITY 03

RF and microwave boards with controlled dielectric properties.

For RF, antenna, radar, and microwave applications, standard FR4 is not sufficient. We fabricate on Rogers RO4000 series, RO3000 series, PTFE composites, and other specialty laminates with controlled Dk and Df values.

Rogers RO4350B, RO4003C
Rogers RO3010, RT/Duroid
PTFE composites
Dk tolerance ±0.05
Low loss Df <0.004
50Ω microstrip design
Flexible and rigid sections in one integrated board.
04
Rigid-Flex
RIGID-FLEX PCB
CAPABILITY 04

Flexible and rigid sections in one integrated board.

Rigid-flex PCBs combine the reliability of rigid boards with the flexibility of FPC. Ideal for wearables, medical devices, and applications where the board must bend. We manufacture and assemble rigid-flex as a single turnkey project.

Polyimide (PI) flex substrate
1–8 flex layers
Min bend radius: 6× board thickness
Static and dynamic flex
ZIF connectors assembled
Conformal coating available
Metal core PCBs for LED and high-power applications.
05
MCPCB
ALUMINUM MCPCB
CAPABILITY 05

Metal core PCBs for LED and high-power applications.

Aluminum metal core PCBs (MCPCB) provide excellent thermal management for high-power LED arrays, motor driver boards, and power electronics. The aluminum base conducts heat away from components, extending product life.

Aluminum base: 1.0–3.0mm thick
Thermal conductivity: 1–3 W/mK
Dielectric layer: 75–150μm
Single & double-sided
LED array layouts
Custom shapes & cutouts
Verified electrical performance on every controlled-impedance board.
06
Verified
IMPEDANCE CONTROL & TESTING
CAPABILITY 06

Verified electrical performance on every controlled-impedance board.

Controlled impedance is critical for high-speed digital signals, RF traces, and differential pairs. We model and verify impedance during fabrication and test every board with TDR or vector network analyzer. Test reports included.

Single-ended: 25Ω–150Ω
Differential pairs: 50Ω–120Ω
Tolerance: ±10% standard, ±5% tight
TDR testing on every board
Coupon-based verification
Test report with shipment

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