Capabilities reviewed.
Built to the agreed scope.
From standard FR4 to specialty materials, HDI, rigid-flex, and aluminum MCPCB projects, available fabrication and assembly capabilities are confirmed case by case after engineering review.
Multi-layer PCB requirements reviewed for each project.
Layer count, materials, board dimensions, hole sizes, impedance requirements, and target lead time are reviewed against the project files before quotation.
HDI requirements reviewed for compact designs.
Micro-via, blind-via, buried-via, via-in-pad, trace-space, and lamination requirements are reviewed case by case based on the design files and agreed production scope.
RF and microwave material requirements reviewed by project.
Rogers, PTFE, controlled dielectric, impedance, and RF-related fabrication requirements can be reviewed against the stack-up, frequency, and customer specifications before quotation.
Flexible and rigid sections in one integrated board.
Rigid-flex construction, flex layers, bend requirements, connectors, and coating needs can be reviewed as part of a turnkey PCBA project before quotation.
Metal core PCBs for LED and high-power applications.
Aluminum MCPCB material, thermal, dielectric, thickness, layout, and shape requirements can be reviewed for LED, motor-control, and power-electronics projects.
Controlled-impedance and test requirements reviewed by project.
Controlled-impedance targets, verification method, inspection scope, and required documentation can be discussed before quotation and confirmed in the agreed project scope.
Not sure which spec fits your design?
Upload your Gerber files so our engineering team can identify open requirements and confirm the available process, inspection, documentation, and target lead time before quotation.
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