Every board tested.
Every shipment documented.
Four layers of quality control from incoming components to final shipment. Trained QC operators, modern inspection equipment, and full traceability on every order.
Every component verified before it touches your board.
All incoming components are inspected against the BOM before stock-in. We check authenticity, date codes, packaging integrity, and dimensions using digital calipers and optical loupes. Counterfeit components are rejected immediately — we only use parts from authorized distributors.
100% automated optical inspection after every SMT run.
Every board goes through AOI immediately after reflow soldering. The system scans for missing components, misalignment, solder bridges, polarity errors, and lifted pins. Boards with any AOI failure are quarantined and reviewed by a trained QC operator before rework or scrap.
Hidden solder joints verified inside and out.
BGAs, QFNs, LGAs, and other bottom-terminated components cannot be inspected visually. Our X-Ray system images solder balls through the package, checking for voids, bridges, open joints, and misalignment. Mandatory for any board with area-array packages.
Every board powered on and verified against your spec.
We perform functional testing using your test specification, test fixture, or firmware. Boards are powered up and tested for signal integrity, peripheral communication, power consumption, and custom pass/fail criteria. A signed test report is included with every shipment.
Want to discuss your quality requirements?
Tell us your IPC class, test spec, and any custom requirements. We'll confirm what's covered in our standard process and what needs a custom setup.
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